Fabrication
Cleanroom Laboratories
We use the Cleanroom Laboratories at the Paul Scherrer Institute, which are operated by the Laboratory for Nano and Quantum Technologies and are very grateful for the support of their staff. Please click on the image for more information.
3D Laser Printing with Nanoscribe
• 3D Polymer structuring by two- photon absorption • Spatial resolution <150 nm • Sample size max. 100 x 100 mm2
Pulsed Laser Deposition (PLD)
• Pulsed KrF Excimer Laser • Base pressure: ~10-7 Torr • Substrate heater 20°C - 900°C
Magnetron Sputtering
Oxford Argon Ion Miller
• Ar ion milling and deposition • 15 cm ion sources • Ion energy 50 - 1500 eV • Base pressure 10-7 Torr • 4-inch wafer capability • Loadlock • Tiltable Sample
Manual wire bonder TPT HB05
• Wire bonder applications: making interconnections between a device and outer environment or semiconductor circuit for electrical measurements. • Wire is attached by a combination of downward pressure and ultrasonic energy. Possibility to use heating stage. • Wedge, Ball, Bump and Ribbon bonding can be done with 17 μm to 75 μm wire and 25 μm x 250 μm ribbon. • Ultrasonic system with 63.3 kHz Transducer PLL Control, 0–10 W output and 0–20000 ms duration. • Motorized clamp movement and electronic ball size control.